September 26, 2005 – WiSpry, Inc., developer of low-cost, high-performance radio frequency micro-electro-mechanical systems (RF-MEMS) tunable components and modules for the wireless industry, is providing collaborative funding for research into advanced RF-MEMS packaging technologies in association with Sandia National Laboratories and the University of Arkansas.  The research, funded by a National Science Foundation grant with matching funds from WiSpry, is focused on developing wafer-level encapsulation and chip-scale interconnection technologies for the packaging of micro electromechanical systems (MEMS).  WiSpry’s products create revolutionary wireless architectures enabled by the cost-effective integration of reconfigurable RF front-ends in cellular phones. 

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